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Laptop Solutions Co.,Ltd



 
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Intel FW82801CAM HUB3 ICH3-M South Bridge SL5YP IC Chip

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Intel FW82801CAM HUB3 ICH3-M South Bridge SL5YP IC Chip

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All Chipsets with ball that installed by qualified technicians with the proper BGA equipment.

 

Brand:  Intel ®

Model: FW82801CAM (South Bridge)

Setp Code: SL5YP      (ICH3-M)

Condition: Brand New & Original Packing

Payment: Paypal or T/T (Bank Transfer)

 

Product Description:

 

Intel® FW82801CAM Chipset Features

Features

Benefits

400MHz System Bus

Delivers a high-bandwidth connection between the Mobile Intel® Pentium® 4 processor - M and the platform

Intel® I/O Hub architecture

Provides a high bandwidth (266MB/s) I/O pipe that delivers fast communications and reduces latency time for I/O operations.

DDR 200/266 MHz SDRAM

Choice of memory technology to support a full range of price/performance requirements up to 1GB. DDR memory offers high reliability and consumes minimal power, critical to the mobile PC platform

AGP4X interface

Provide the most advanced graphics support available, enabling over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D, and video streams

Enhanced Intel Speedstep® Technology

Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life

Deeper Sleep Alert State

New dynamic power management mode operates at 66% lower voltage than Deep sleep mode for longer battery life

Advanced Power Management

Supports ACPI 2.0 compliant for the latest power management and legacy power management with APM 1.2 compliant.

Ultra ATA/100

Takes advantage of the latest industry innovations in HDD features and performance

Latest AC97 Controller

Excellent audio quality, with up to six channels for full surround sound capability including a simultaneous modem connection

Thin & Small Package Technology

Intel® 845MP/MZ chipset uses Intel's most advanced Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability.

 

 

 




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